There are many terms used in the M2M/ IoT/ Telecom world that can be confusing. Here’s an attempt to make sense of it.
Standard/ Traditional SIM (2nd form factor)
3-in-1 plug-in SIMs
SIMs that can be broken into Standard, Micro and Nano SIM form factors
Micro SIM (3rd form factor)
Nano SIM (4th form factor)
Automotive grade SIMs
Purpose built to comply with the automotive sectors’ tough quality management standards (such as PPAP, AEC-Q100) and with higher data retention span (15-17 years).
Embedded SIMs (eSIMs)
SIMs that can be embedded into devices, not meant for plug-in slots typically found in handsets. The machine Form Factor with the widely accepted Surface Mounted Device (SMD) form factor now being MFF2.
While previously, a SIM would belong to a particular network operator, the eUICC allows the user to take control of the connectivity.
Industrial grade SIMs
Produced with higher resistance with an expanded temperature range of -40°C and +105°C. Other factors such as corrosion and impact on SIMs from vibrations were also improved.
Standard embedded SIM Surface Mounted Device (SMD) (Machine form factor 2)
Standard grade SIMs
Operational within a temperature range of -25°C and +85°C
Referred to also as Remote SIM Provisioning Platform, it is the counterpoint to interact with eUICC SIMs to manage profiles on a SIM.