Physical attributes

Form Factors

SIMs can be provided in various Form Factors which usually depends on the use case and the environment the SIM is being used in. ConnectedYou SIM is available in 2 Form Factors:

Grades

The physical qualities of the SIMs are also differentiated based on usage. The 3 grades of SIMs offered are: Standard, Industrial & Automotive.

Features	Standard	Industrial	Automotive
SIM Chip	ST33G1M2-ST	ST33G1M2-M	ST33G1M2-A
Use case	Ideal for standard applications	Resistant to high temperature, shocks, vibration s and humidity	Resistant to high temperature, shocks, vibrations and humidity. Automotive requirements compliancy
Applicable for	3in1 plug-in SIM	3in1 plug-in SIM embedded SIM MFF2	embedded SIM MFF2
Certifications	-	JEDEC	JEDEC, AEC Q100 / TS 16 949
Data retention	10 years	17 years data retention at 85ºC; 10 years at 105ºC	17 years data retention at 85ºC; 10 years at 105ºC
Operating temperature range	-25ºC to +85ºC	-40ºC to +105ºC	-40ºC to +105ºC
Erase/Write cycles	100,000	500,000	500,000
Voltage	1.8V, 3V, 5V	1.8V, 3V, 5V	1.8V, 3V, 5V
Operating supply voltage	1.62V – 5.5V	1.62V – 5.5V	1.62V – 5.5V
FLASH	1280K	1280K	1280K
RAM	30K	30K	30K
Internal clock	up to 25 MHz	up to 25 MHz	up to 25 MHz
External clock	from 1 MHz up to 10 MHz	from 1 MHz up to 10 MHz	from 1 MHz up to 10 MHz
I/O ISO 7816-3	(T=0)	(T=0)	(T=0)
I/O speed	8, 16, 31, 32, 64, 186, 372 clocks per ETU	8, 16, 31, 32, 64, 186, 372 clocks per ETU	8, 16, 31, 32, 64, 186, 372 clocks per ETU

Data sheets available for download

• ST33G1M2-ST

• ST33G1M2-M

• ST33G1M2-A

Hardware Packaging specifications

Refer to MFF2 specifications for hardware packaging specifications.

MFF2 Specifications